ISBN: 9781439819104
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—inclu… mais…
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Introduction to Microsystem Packaging Technology by Jing, Jin, Yufeng, Wang, Zhiping Chen - livro usado
ISBN: 9781439819104
Vastly ahead of the field, this resource demonstrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. It a… mais…
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2010, ISBN: 9781439819104
Taylor & Francis Inc, Gebundene Ausgabe, Auflage: UK ed. 232 Seiten, Publiziert: 2010-09-23T00:00:01Z, Produktgruppe: Book, Hersteller-Nr.: 138 black & white illustrations, 16 blac, 1.5 k… mais…
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2010, ISBN: 9781439819104
Taylor & Francis Inc, Gebundene Ausgabe, Auflage: UK ed. 232 Seiten, Publiziert: 2010-09-23T00:00:01Z, Produktgruppe: Book, Hersteller-Nr.: 138 black & white illustrations, 16 blac, 1.5 k… mais…
Amazon.de (Intern... |
ISBN: 9781439819104
Introduction to Microsystem Packaging Technology Introduction-to-Microsystem-Packaging-Technology~~Yufeng-Jin Science>Engineering>ELEC Engr Hardcover, Taylor & Francis
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ISBN: 9781439819104
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—inclu… mais…
Jing, Jin, Yufeng, Wang, Zhiping Chen:
Introduction to Microsystem Packaging Technology by Jing, Jin, Yufeng, Wang, Zhiping Chen - livro usadoISBN: 9781439819104
Vastly ahead of the field, this resource demonstrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. It a… mais…
2010
ISBN: 9781439819104
Taylor & Francis Inc, Gebundene Ausgabe, Auflage: UK ed. 232 Seiten, Publiziert: 2010-09-23T00:00:01Z, Produktgruppe: Book, Hersteller-Nr.: 138 black & white illustrations, 16 blac, 1.5 k… mais…
2010, ISBN: 9781439819104
Taylor & Francis Inc, Gebundene Ausgabe, Auflage: UK ed. 232 Seiten, Publiziert: 2010-09-23T00:00:01Z, Produktgruppe: Book, Hersteller-Nr.: 138 black & white illustrations, 16 blac, 1.5 k… mais…
ISBN: 9781439819104
Introduction to Microsystem Packaging Technology Introduction-to-Microsystem-Packaging-Technology~~Yufeng-Jin Science>Engineering>ELEC Engr Hardcover, Taylor & Francis
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Dados detalhados do livro - Introduction to Microsystem Packaging Technology Yufeng Jin Author
EAN (ISBN-13): 9781439819104
ISBN (ISBN-10): 1439819106
Livro de capa dura
Livro de bolso
Ano de publicação: 2010
Editor/Editora: Taylor & Francis Core >2 >T
232 Páginas
Língua: eng/Englisch
Livro na base de dados desde 2010-03-24T05:18:20-03:00 (Sao Paulo)
Página de detalhes modificada pela última vez em 2023-12-11T14:17:21-03:00 (Sao Paulo)
Número ISBN/EAN: 1439819106
Número ISBN - Ortografia alternativa:
1-4398-1910-6, 978-1-4398-1910-4
Ortografia alternativa e termos de pesquisa relacionados:
Autor do livro: chen, jin jing, wang jing
Título do livro: jin jing, microsystem technologies, packaging introduction
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