- 5 resultados
menor preço: € 58.01, preço mais alto: € 115.62, preço médio: € 76.97
1
Pick-up Process Analysis of a Die Bonder - Lin, Yeong-Jyh Hwang, Sheng-Jye
Encomendar
no/na booklooker.de
€ 69.95
Envio: € 0.001
Encomendar
Detalhes fornecedor
Link patrocinado
Lin, Yeong-Jyh Hwang, Sheng-Jye:

Pick-up Process Analysis of a Die Bonder - encadernada, livro de bolso

2013, ISBN: 9783639000344

[ED: Kartoniert / Broschiert], [PU: VDM Verlag Dr. Mueller VDM Verlag Dr. Mueller e.K.], Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. T… mais…

Custos de envio:Versandkostenfrei, Versand nach Deutschland. (EUR 0.00) Moluna GmbH
fechar(X)
2
Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method - Lin, Yeong-Jyh, Hwang, Sheng-Jye
Encomendar
no/na amazon.co.uk
£ 50.00
(aproximadamente € 58.01)
Envio: € 5.201
Encomendar
Detalhes fornecedor
Link patrocinado

Lin, Yeong-Jyh, Hwang, Sheng-Jye:

Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method - Livro de bolso

2008, ISBN: 9783639000344

VDM Verlag Dr. Müller, Paperback, 136 Seiten, Publiziert: 2008-04-17T00:00:01Z, Produktgruppe: Book, 0.19 kg, Mechanics, Civil Engineering, Engineering & Technology, Science, Nature & Mat… mais…

Custos de envio:In stock. Lieferung von Amazon. (EUR 5.20) Amazon.co.uk
fechar(X)
3
Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method - Sheng-Jye Hwang, Yeong-Jyh Lin
Encomendar
no/na AbeBooks.de
€ 72.67
Envio: € 36.351
Encomendar
Detalhes fornecedor
Link patrocinado
Sheng-Jye Hwang, Yeong-Jyh Lin:
Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method - Livro de bolso

2008

ISBN: 363900034X

[EAN: 9783639000344], Neubuch, [PU: VDM Verlag Dr. Müller], Clean and crisp and new!, Books

NEW BOOK. Custos de envio: EUR 36.35 Welcome Back Books, Toledo, OH, U.S.A. [64434632] [Rating: 5 (von 5)]
fechar(X)
4
Encomendar
no/na alibris.co.uk
€ 68.62
Encomendar
Detalhes e envio
Link patrocinado
Lin, Yeong-Jyh, and Hwang, Sheng-Jye:
Pick-up Process Analysis of a Die Bonder - Livro de bolso

2008, ISBN: 9783639000344

Trade paperback, New., Trade paperback (US). Glued binding. 136 p., Saarbrucken, [PU: VDM Verlag Dr. Mueller E.K.]

Custos de envio:mais custos de envio Sparks, NV, Alibris
fechar(X)
5
Encomendar
no/na Biblio.co.uk
$ 127.00
(aproximadamente € 115.62)
Envio: € 19.121
Encomendar
Detalhes fornecedor
Link patrocinado
Yeong-Jyh Lin, Sheng-Jye Hwang:
Pick-up Process Analysis of a Die Bonder - Livro de bolso

2008, ISBN: 9783639000344

VDM Verlag Dr. Mueller e.K, 2008-04-22. Paperback. Used:Good., VDM Verlag Dr. Mueller e.K, 2008-04-22, 0

Custos de envio: EUR 19.12 Ergodebooks
fechar(X)
1Como algumas plataformas não transmitem condições de envio e estas podem depender do país de entrega, do preço de compra, do peso e tamanho do item, de uma possível adesão à plataforma, de uma entrega direta pela plataforma ou através de um fornecedor terceirizado (Marketplace), etc., é possível que os custos de envio indicados pela terralivro não correspondam aos da plataforma ofertante.

Dados bibliográficos do melhor livro correspondente

Pormenores referentes ao livro
Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method
Autor:
Título:
Número ISBN:

363900034X


The gallium arsenide (GaAs) circuits in advanced communication application have been considered to profoundly supersede the conventional silicon-based counterpart. Great improvements in the packaging of GaAs devices are needed to overcome the imminent handicap of its fragile characteristic; Thin die represents the mainstream for IC packages to achieve the goal of manufacturing compact and light products with higher functionality. These trends tend to challenge the existing infrastructure, henceforth; the creative design in connection with a unique die bonder in fabrication has been presented in this book. The general process to pick up a die was comprehensively investigated and then analyzed with computer simulations. Experiments were conducted to verify the simulation results. The die cracks due to the ejecting needle; and the effects of parameter were analyzed by means of Taguchi Method. With this procedure, not only the parameters could be optimized but also the production yield was promoted. Besides, this method could be easily modified to simulate other type of die bonders with different mechanisms; even a new procedure could be derived for the next generational die bonder.

Dados detalhados do livro - Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method


EAN (ISBN-13): 9783639000344
ISBN (ISBN-10): 363900034X
Livro de capa dura
Livro de bolso
Ano de publicação: 2008
Editor/Editora: VDM Verlag Dr. Müller
136 Páginas
Peso: 0,219 kg
Língua: eng/Englisch

Livro na base de dados desde 2008-12-02T12:52:03-02:00 (Sao Paulo)
Página de detalhes modificada pela última vez em 2023-08-08T16:14:01-03:00 (Sao Paulo)
Número ISBN/EAN: 363900034X

Número ISBN - Ortografia alternativa:
3-639-00034-X, 978-3-639-00034-4
Ortografia alternativa e termos de pesquisa relacionados:
Autor do livro: pick, hwang, compact verlag
Título do livro: pick, der process, analysis, bönder

< Para arquivar...