Three Dimensional System Integration - encadernada, livro de bolso

EAN (ISBN-13): 9781441909619
ISBN (ISBN-10): 1441909613
Livro de capa dura
Livro de bolso
Ano de publicação: 2010
Editor/Editora: Springer
246 Páginas
Peso: 0,527 kg
Língua: eng/Englisch

Livro na base de dados desde 2008-04-22T10:15:08-03:00 (Sao Paulo)
Página de detalhes modificada pela última vez em 2023-06-08T18:36:15-03:00 (Sao Paulo)
Número ISBN/EAN: 9781441909619

Número ISBN - Ortografia alternativa:
1-4419-0961-3, 978-1-4419-0961-9
Ortografia alternativa e termos de pesquisa relacionados:
Autor do livro: papanikolaou, rado, papan, radojcic, riko
Título do livro: three dimensional design, integration, whole system design, process design

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Dados da editora

Autor: Antonis Papanikolaou; Dimitrios Soudris; Riko Radojcic
Título: Three Dimensional System Integration - IC Stacking Process and Design
Editora: Springer; Springer US
246 Páginas
Ano de publicação: 2010-12-15
New York; NY; US
Impresso / Feito em
Língua: Inglês
53,49 € (DE)
54,99 € (AT)
59,00 CHF (CH)
POD
VIII, 246 p.

BB; Hardcover, Softcover / Technik/Bautechnik, Umwelttechnik; Hochbau und Baustoffe; Verstehen; 3D Chip Stacking; 3D Integrated Circuit Design and Manufacturing; 3D Integrated Circuits; 3D Stacked Integrated Circuits; 3D System Integration; Contactless 3D Coupling; DRAM Stacking; Logic Stacking; TSV; Through-Silicon Vias; Building Construction and Design; Electronic Circuits and Systems; Schaltkreise und Komponenten (Bauteile); BC

Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides an overview of the entire trajectory from basic process technology issues to the design at the system level of three dimensionally integrated nano-electronic systems. Physical design and design at the architecture and system level are emphasized in this book, since the technology has matured to the point that these issues have become very important. This book is intended for an audience with a basic grasp of electrical engineering concepts including some familiarity with fabrication of semiconductor devices, Very Large Scale Integration (VLSI) and computer architecture. •Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her work; •Provides a high-level (tutorial-like) description of 3D system integration that will cover issues ranging from process technology and manufacturing of 3D systems to the design of 3D components and entire systems; •First book to offer not only a high-level view of the entire field of 3D integration, but also an understanding of theinteractions between the various phases of design and manufacturing.
Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her work; Provides a high-level (tutorial-like) description of 3D system integration that will cover issues ranging from process technology and manufacturing of 3D systems to the design of 3D components and entire systems Includes supplementary material: sn.pub/extras