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Stress Analysis of Bonded Assemblies: Applications in Microelectronics | Axisymmetric Assemblies under Thermal Loading | Shilak Shakya | Taschenbuch | Englisch | VDM Verlag Dr. Müller - Shakya, Shilak
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Shakya, Shilak:

Stress Analysis of Bonded Assemblies: Applications in Microelectronics | Axisymmetric Assemblies under Thermal Loading | Shilak Shakya | Taschenbuch | Englisch | VDM Verlag Dr. Müller - Livro de bolso

ISBN: 9783639060324

[ED: Taschenbuch], [PU: VDM Verlag Dr. Müller], Four analytical models are developed for predictingthe maximum shearing displacement in a bondedassembly under global thermal mismatch load… mais…

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Shilak Shakya:

Stress Analysis of Bonded Assemblies: Applications in Microelectronics (Paperback) - Livro de bolso

2008, ISBN: 3639060326

[EAN: 9783639060324], Neubuch, [PU: VDM Verlag Dr. Mueller E.K., Germany], Language: English. Brand new Book. Four analytical models are developed for predicting the maximum shearing disp… mais…

NEW BOOK. Custos de envio: EUR 5.94 The Book Depository EURO, London, United Kingdom [60485773] [Rating: 3 (von 5)]
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Stress Analysis of Bonded Assemblies: Applications inMicroelectronics - Shakya, Shilak
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Shakya, Shilak:
Stress Analysis of Bonded Assemblies: Applications inMicroelectronics - Livro de bolso

2008

ISBN: 3639060326

[EAN: 9783639060324], Neubuch, [PU: VDM Verlag Dr. Müller], TECHNIK MIKROELEKTRONIK, Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung für Sie gedruckt. Four… mais…

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Shilak Shakya:
Stress Analysis of Bonded Assemblies Applications in Microelectronics - Livro de bolso

2009, ISBN: 9783639060324

Softcover, New Book. Shipped from UK in 4 to 14 days. Established seller since 2000. Please note we cannot offer an expedited shipping service from the UK., [PU: VDM Verlag Dr. Mueller E.K.]

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Shilak Shakya:
Stress Analysis of Bonded Assemblies Applications in Microelectronics - Livro de bolso

2008, ISBN: 3639060326

[EAN: 9783639060324], Neubuch, [PU: VDM Verlag], New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000., Books

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Stress Analysis of Bonded Assemblies: Applications inMicroelectronics

Four analytical models are developed for predicting the maximum shearing displacement in a bonded assembly under global thermal mismatch loading. Analytical model includes: i) elastic analysis, ii) elasto-plastic analysis, iii) viscoelastic analysis, and iv) viscoelastic-plastic analysis. All results have been derived as closed-form correction factors to be applied to the easily calculated unconstrained shear displacement to obtain the maximum shear displacement. The motivation for determining the maximum shear displacement is to compute the maximum shear strain, which is then used to estimate the cycles-to-failure by means of a fatigue law. The analytical relations derived are simple, easy-to-use, and helpful for studying the interaction among the various design parameters. The analytical relations are in good agreement with existing experimental and numerical results.

Dados detalhados do livro - Stress Analysis of Bonded Assemblies: Applications inMicroelectronics


EAN (ISBN-13): 9783639060324
ISBN (ISBN-10): 3639060326
Livro de capa dura
Livro de bolso
Ano de publicação: 2008
Editor/Editora: VDM Verlag
256 Páginas
Peso: 0,398 kg
Língua: eng/Englisch

Livro na base de dados desde 2007-08-24T21:34:49-03:00 (Sao Paulo)
Página de detalhes modificada pela última vez em 2023-12-02T11:36:42-03:00 (Sao Paulo)
Número ISBN/EAN: 9783639060324

Número ISBN - Ortografia alternativa:
3-639-06032-6, 978-3-639-06032-4
Ortografia alternativa e termos de pesquisa relacionados:
Título do livro: analysis, thermal stress, applications, microelectronics


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