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Ramm:

Handbook of Wafer Bonding - nuovo livro

2006, ISBN: 9783527326464

[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… mais…

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Ramm:

Handbook of Wafer Bonding - nuovo livro

2006, ISBN: 9783527326464

[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… mais…

Custos de envio:Versandkostenfrei, Versand nach Deutschland. (EUR 0.00) Rheinberg-Buch
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Ramm:
Handbook of Wafer Bonding - nuovo livro

2006

ISBN: 9783527326464

[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… mais…

Custos de envio:Versandkostenfrei, Versand nach Deutschland. (EUR 0.00) buchversandmimpf2000
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Handbook of Wafer Bonding - Ramm
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Ramm:
Handbook of Wafer Bonding - encadernada, livro de bolso

2012, ISBN: 3527326464

Gebundene Ausgabe Elektronik / Halbleiter, Halbleiter, Leitung (physikalisch) / Halbleiter, Materialwissenschaft, Nanotechnologie, Technologie / Nanotechnologie, mit Schutzumschlag 11, [… mais…

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Handbook of Wafer Bonding - Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo
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Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo:
Handbook of Wafer Bonding - encadernada, livro de bolso

ISBN: 9783527326464

hardback, [PU: Wiley-VCH, Weinheim]

in stock. Custos de envio:Usually dispatched within 48 hours. (EUR 7.60) Blackwells.co.uk

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Handbook of Wafer Bonding

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.

Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.

This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

Dados detalhados do livro - Handbook of Wafer Bonding


EAN (ISBN-13): 9783527326464
ISBN (ISBN-10): 3527326464
Livro de capa dura
Ano de publicação: 2012
Editor/Editora: Wiley-VCH
395 Páginas
Peso: 0,937 kg
Língua: Englisch

Livro na base de dados desde 2008-09-14T10:42:19-03:00 (Sao Paulo)
Página de detalhes modificada pela última vez em 2024-01-24T16:43:42-03:00 (Sao Paulo)
Número ISBN/EAN: 3527326464

Número ISBN - Ortografia alternativa:
3-527-32646-4, 978-3-527-32646-4
Ortografia alternativa e termos de pesquisa relacionados:
Autor do livro: ramm, peter james, peter troy, jia, jian, wiley vch verlag gmbh
Título do livro: bon, bonding, bond, handbook


Dados da editora

Autor: Peter Ramm; James Jian-Qiang Lu; Maaike M. V. Taklo
Título: Handbook of Wafer Bonding
Editora: Wiley-VCH; Wiley-VCH
396 Páginas
Ano de publicação: 2012-01-11
Impresso / Feito em
Peso: 0,924 kg
Língua: Inglês
185,00 € (DE)
190,20 € (AT)
Available
170mm x 240mm x 26mm

BB; Hardcover, Softcover / Chemie/Sonstiges; Nanowissenschaften; Verstehen; Chemie; Components & Devices; Electrical & Electronics Engineering; Elektrotechnik u. Elektronik; Halbleiterphysik; Komponenten u. Bauelemente; MEMS; Mikrosystemtechnik; Nanomaterial; Nanomaterialien; Nanomaterials; Nanostrukturiertes Material; Nanotechnologie; Nanotechnology; Physics; Physik; Semiconductor Physics; Wafer; MEMS; Komponenten u. Bauelemente; Nanomaterialien; Halbleiterphysik; Nanotechnologie

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories - Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

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